Design of Experiments. A systematic approach to investigating product failures, orproduct / process improvements.

Electro-Static Discharge. High levels of ESD can damage circuits with sensitive components like mosfet transistors.

Failure Mode and Effect Analysis. A systematic approach to anticipating possible product or process failures aimed at formulating preventive / corrective actions.

Test procedure that simulates the operation of a certain assembly. Used to screen lots for defective units.

A methodical approach to problem-solving following established eight (8) disciplines.

In-Circuit Test. A computer-based test system that checks for open/short circuits, wrong and/or defective components.

International Organization for Standar-dization. An internationally-recognized body that sets standards for quality, environmental, and other systems.

Master Production Schedule. One of the inputs to an MRP system that helps determine purchasing and production schedule.

Material Requirements Planning. A computer-based inventory management system that determines purchasing requirements among others.

Printed Circuit Board. Bare board with circuit (connections) layout.

Printed Circuit Board Assembly. PCB stuffed with electronic components, with the end product able to perform certain functions.

Quality Control/Quality Assurance

Surface Mount Technology. PCBA technology making using of unleaded components.

Statistical Process Control. Use of charts and graphs to monitor, analyze, and control production processes.

A test procedure where assembled PCBAs are subjected to extreme temperatures to determine reliability.